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SMD placement: AdVantis, Fuzion, Genesis


For further information: Pehr Nordman
mobile: +358 400 500 594

Value Driven Performance

AdVantis™ from Universal Instruments is a platform machine built specifically to solve diverse modern assembly challenges by delivering the high-end performance, consistency and robustness you need at an ultimate value. AdVantis is an adept placement platform delivering best-in-class performance in the world's most cost-sensitive markets, including consumer and industrial electronics, PCs, peripherals, and high-mix environments. Its innovative technologies and intelligent design attributes combined with our legendary support infrastructure, put the emphasis firmly on minimizing cost of ownership and maximizing your returns.


AdVantis_overall_closeup_sm














We have built the AdVantis to be lean, but perfectly featured for its environment. Like all Universal platforms, stability and reliability are designed in. Choose AdVantis to bid more aggressively, conquer emerging markets and demonstrate quick turnaround. AdVantis offers a highly optimized feature-set to boost the bottom line of manufacturers with a modest capital budget.

AdVantis AC-30L – A high speed chip placement platform utilizing the 30-spindle Lightning head with dual on-the-head camera optics. Spec speed 0.11 sec/placement (33,600 cph) and component range 0201 - 30mm x 30mm, 6mm tall.


AdVantis line
AdVantis line w_bckgrnd





Fuzion



Fuzion

Build better. Build more. Spend less.

Maximize utilization and Overall Equipment Effectiveness (OEE)

* High-mix agility

* Sustained high-volume productivity

Optimize performance for any product mix

* Build any product at any time

* Solutions for any environment

Accelerate NPI and achieve 100% first-pass yield

* Comprehensive prototyping solutions

* Seamless transition to volume

Enjoy lowest cost of operation and ownership

* Lower CapEx investment

* Reduced operating costs


Platform



Today’s electronics environment presents manufacturers with a significant challenge to reduce costs and time-to-market in a contracted market window – all while delivering the best in features, flexibility and performance in the products they build.
Fuzion™ enables manufacturers to accommodate the most diverse revenue stream and produce a full range of products in a lean environment – build any product at any time, accelerate new product introduction and ramp to volume, maximize utilization, quality, and yield. Fuzion enables operational excellence to deliver considerable cost savings, increased productivity and ultimate profitability.




Fuzion1-11 – Versatile IC placement platform perfect for special processes such as Pin-in-Paste, Flip Chip and OFA

* Single-beam

* One 7-spindle FZ7 and one 4-spindle FZ4 placement head

* Upward-looking vision system

Fuzion1-30 – Superb for high-mix NPI environments and large board applications. Also a high-volume line booster.

* Single-beam

* One 30-spindle rotary FZ30 placement head

* Dual on-the-head optics

Fuzion2-14 – Best-in-class multi-function machine with fast placement of a wide component range for applications

* Dual-beam

* Two 7-spindle FZ7 placement heads

* Upward-looking vision system

Fuzion2-37 – A true multi-purpose platform. A versatile stand-alone prototyping solution, a flexible line balancer, or a high-performance multi-function solution.

* Dual-beam

* One 30-spindle rotary FZ30 and one 7-spindle FZ7 placement head

* Dual on-the-head optics and upward-looking vision system

Fuzion2-60 – Flexible, high-speed productivity for medium-volume environments. A powerful line booster solution or high-performance small part placer.

* Dual-beam

* Two 30-spindle rotary FZ30 placement heads

* Dual on-the-head optics

FuzionXC2-37 – High-capacity NPI, all-in-one, line balancer, or multifunction solution with a full component range

* Dual-beam

* One 30-spindle rotary FZ30 and one 7-spindle FZ7 placement head

* Dual on-the-head optics and upward-looking vision system

FuzionXC2-60 – Cost-efficient, high-performace turret replacement or high-input chip placer

* Dual-beam

* Two 30-spindle rotary FZ30 placement heads

* Dual on-the-head optics

Fuzion4-120 – Powerful performance for high-volume production environments: Consumer, Mobile, Notebook, Auto

* Quad-beam

* Four 30-spindle rotary FZ30 placement heads

* Dual on-the-head optics




Genesis overall

Genesis overall












The Flexibility You Want. The Performance You Need.

Genesis is the ultimate in modular performance, delivering the flexibility you want and the performance you need to succeed in today’s dynamic manufacturing environment. Genesis is based on the platform philosophy originated by Universal Instruments, with common heads, cameras, feeders, control architecture, training, spares, & maintenance routines.

Not sure what you’ll be building from day to day? No problem. Genesis provides scalable performance with incremental units of capacity via single, dual, and quad-beam versions for maximum productivity at all volumes regardless of product mix. In addition, Genesis can be configured for big-board or NPI lines.

Genesis takes advantage of a quad-gantry platform architecture and patented technologies designed for speed to deliver best-in-class throughput and cost performance.

Genesis is flexible, requiring no hardware reconfiguration for product changes. Genesis utilizes head technologies with the broadest components range in the industry. Simply change the program, not the line or heads.







Patented technologies and specific tools for precision small part placement give Genesis the outright lead in small part performance and accuracy.

Think all this performance requires substantial upkeep? Not at all. Genesis is built on a robust platform specifically designed for ease of maintenance and low cost-of-ownership.

If you're looking for the most up to date solution to energize your high performance assembly, you’ll find the answer in Genesis.









Lightning Head on stand, no cover, close up

Lightning Head on stand, no cover, close up


























Lightning Head on stand, no cover, close up

Lightning Head on stand, no cover, close up













AdVantis AX-72e – A flexible placement platform with single, mixed head or dual-head capability, the AdVantis AX-72 can be configured with a 7-spindle placement head and a 4-spindle head to deliver the widest component range (from chips to 25mm tall odd form) on the same platform and improve utilization. Spec speed 0.19 sec/placement (18,900 cph) and component range 0603mm (0201) - 55mm x 55mm SFOV.

AdVantis AI-42e – A cost-effective IC and odd form placement platform utilizing a 4-spindle flexible head with high force insertion capability and highly-flexible upward looking camera optics for standard to highly complex odd form devices. Component range 0603 (0201) - 55mm x 55mm SFoV, 150mm MFoV and feeder types: tape, tray, tube, component strips, bulk, bowl, old-form, custom.





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