- High-speed solder joint inspection
- Highest inspection depth
- Simple operation
- Fast, precise, and shadow-free 3D analyses
with XM 3D high-performance sensor technology - Unique analysis of QFN, DFN, and QFP de-wetting
using angled views - 8 μm resolution – secure 03015 inspection
- Simple operation
- Fast inspection program generation
- Confirmed zero escapes thanks to integrated verification
- Viscom FastFlow Handling, PCB change in up to 2 s
Powerful add-on modules:
- Verification, off-line programming, and SPC evaluation
- Worldwide, competent service on-site, by Hotline, remote maintenance, and customer support area on the Viscom website
