• High-speed solder joint inspection
  • Highest inspection depth
  • Simple operation
  • Fast, precise, and shadow-free 3D analyses
    with XM 3D high-performance sensor technology
  • Unique analysis of QFN, DFN, and QFP de-wetting
    using angled views
  • 8 μm resolution – secure 03015 inspection
  • Simple operation
  • Fast inspection program generation
  • Confirmed zero escapes thanks to integrated verification
  • Viscom FastFlow Handling, PCB change in up to 2 s


Powerful add-on modules:

  • Verification, off-line programming, and SPC evaluation
  • Worldwide, competent service on-site, by Hotline, remote maintenance, and customer support area on the Viscom website